Publication
“If you can't explain it simply, you don't understand it well enough”
Journal Papers
T. Dinh, T.-K. Nguyen, H.-P. Phan, Q. Nguyen, J. Han, S. Dimitrijev, N.-T. Nguyen, D. V. Dao, "Thermoresistance of p-type 4H-SiC integrated MEMS devices for high-temperature sensing", Advanced Engineering Materials, 2018. (IF: 2.576 ) Link
K. R. Sreejith, C. H. Ooi, J. Jin, D. V. Dao and N.-T. Nguyen, "Digital polymerase chain reaction technology – recent advances and future perspectives",Lab on a Chip, 18(24), pp.3717-3732, 2018. (IF: 5.995) Link
J. Fastier-Wooller, T. Dinh, V. Dau, H.-P. Phan, F. Yang, D. V. Dao, "Low-Cost Graphite on Paper Pressure Sensor for Robot Gripper with a Trivial Fabrication Process", Sensors, 18(10), p.3300, 2018. (IF: 2.475) Link
F. Lenzini, J. Janousek, O. Thearle, M. Villa, B. Haylock, S. Kasture, L. Cui, H.-P. Phan, D. V. Dao, H. Yonezawa, P. K. Lam, E. H. Huntington, M. Lobino, "Integrated photonic platform for quantum information with continuous variables", Science Advances, 4(12), p.eaat9331, 2018. (IF:11.51) Link
H.-P. Phan, K.M. Dowling, T.-K. Nguyen, C.A. Chapin, T. Dinh, R.A. Miller, J. Han, A. Iacopi, D.G. Senesky, D.V. Dao, and N.-T. Nguyen, "Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures",RSC Advances, 8(52), pp.29976-29979, 2018. (IF: 2.936) Link
T.-K. Nguyen, H.-P. Phan, T. Dinh, A.R. Md Foisal, N.-T. Nguyen, and D.V. Dao, "High-temperature tolerance of piezoresistive effect in p-4H-SiC for harsh environment sensing", Journal of Materials Chemistry C, 6(32), pp.8613-8617, 2018. (IF: 5.976) Link
T. Dinh*, H.-P. Phan*, N. Kashaninejad, T.-K. Nguyen, D.V. Dao, and N.-T. Nguyen, "An on-chip SiC MEMS device with integrated heating, sensing and microfluidic cooling systems", Advanced Materials Interfaces, 5(20), p.1800764, 2018. (IF: 4.843) Link
T.-K. Nguyen, H.-P. Phan, T. Dinh, K.M. Dowling, A.R. Md Foisal, D.G. Senesky, N.-T. Nguyen, and D.V. Dao, "Highly sensitive 4H-SiC pressure sensor at cryogenic and elevated temperatures", Materials and Design, 156, pp.441-445, 2018. (IF: 4.525) Link
H.-P. Phan, T.-K. Nguyen, T. Dinh, H.H. Cheng, F. Mu, A. Iacopi, L. Hold, T. Suga, D.V. Dao, D.G. Senesky, and N.-T. Nguyen, "Strain effect in highly doped n-type 3C-SiC-on-glass substrate for mechanical sensors and mobility enhancement", Phys. Sta. Sol. A., 215(24), p.1800288, 2018. (IF: 1.795) Link
A.R. Md. Foisal, T. Dinh, P. tanner, H.-P. Phan, T.K. Nguyen, E. Etreed, D. V. Dao, "Photoresponse of a highly-rectifying 3C-SiC/Si heterostructure under UV and visible illumination", IEIEEE Electron Device Letters, 39(8), pp.1219-1222, 2018. (IF: 3.048) Link